Abstract
There is disclosed a method for increasing the wafer production, wherein the wafer is processed by a mask exposure procedure to obtain a maximum number of dies. The method defines a datum line in the wafer, and determines, around the datum line, a initial position of mask to obtain the maximum die production. Next, based on the initial position, the surface area of the wafer usable to produce dies is partitioned into multiple regions. Then, based on the terminal coordinate of each region and the length and width of the mask, it is applicable to determine the arrangement of the mask in each region, so as to perform the exposure process to the wafer. The present invention is suitable for the wafers with various diameters, and allows the wafer to be fully utilized, thereby avoiding the waste of production capability and increasing the utilization of the resource.