Abstract
A heat sink device is prepared as utilizing two-phase circulation working-fluid to radiate out heat from computer central processor, circulating said fluid in sealed metal container of said device, forming metal container by bottom region with capillary structure layer used as evaporator and top region with a set of parallel runner, heating and evaporating said working fluid by heat from heating unit then leading evaporated working vapor into each parallel runner, condensing said vapor on top wall of said container to release heat out through wall of metal container and collecting condensed fluid by capillary structure layer at bottom then sending collected fluid back to evaporator under action of capillary.