Abstract
A wafer etch protection device is provided with a wafer protection base and a plurality of wafer clips. The wafer protection base is formed by a steel ring coated with a wafer protection layer. When the wafer protection base and a wafer thereon is clipped together by the plurality of wafer clips, the wafer is closely attached to the protection layer so that the steel ring can uniformly spread the clipping force applied on the wafer. Thereby, the rear surface of the wafer which is not to be etched can be thoroughly sealed for protection.