Abstract
A manufacturing method of an organic light-emitting diode according to the present disclosure includes steps as follows. A substrate is provided and a layered structure forming step is performed. In the layered structure forming step, an anode layer, a scattering layer, an emissive layer and a cathode layer are sequentially formed on the substrate, and an organic light-emitting diode is obtained. The material of the scattering layer is a quasicrystalline material. In this regard, the luminous efficiency and intensity of the organic light-emitting diode are enhanced. The complexity of forming the scattering layer is also reduced, which facilitates the large-scale production.