Abstract
A method for soldering an electronic component to a substrate is provided. The method includes the steps of forming a metal layer on the substrate; applying a solder material on the metal layer; and performing a thermal process to transfer the solder material into a solder joint so as to connect the electronic component with the substrate. During the thermal process, a part of the metal layer is introduced into the solder joint, thereby elevating the eutectoid temperature of the solder joint. This invention also provides an electronic apparatus made by this method.