Abstract
A probeless parallel test system for IC is provided. The test system includes an IC chip, a wireless power receiver and a BIST. The wireless power receiver is electrically connected to the IC chip and the BIST. The wireless power receiver, the BIST and the IC chip are formed in a wafer. The wireless power receiver provides an electrical power to the BIST and the IC chip. The IC chip performs a functional operation after receiving the electrical power, and transfers the functional operation result to the BIST for testing. The whole testing procedures for the IC chip are performed wirelessly, thus no probes are required. Moreover, the test system of the present disclosure is capable for performing a parallel test through the wireless power receiver.