Abstract
This invention relates to a composite capillary structure of a thermoconductive element, comprising an evaporation end of an airtight vacuum chamber connected to a heating element, a condensation end connected to a heat dissipation device, and a capillary structure provided to the internal surface of the vacuum chamber and filled with suitable amount of a working fluid, to perform the evaporation and condensation cycle of the working fluid in the chamber, wherein the capillary structure at the input location of a heat source is compositely formed on the inner surface of the chamber with sintered powder particles and a microstructure with rough and uneven in surface or a meshed structure, to enable the capillary structure to have a higher effective thermal conductivity (Keff) and a lower thermal resistance (Rth), so that the thermal resistance of the system can be effectively reduced by using the composite capillary structure, so as to make the system achieve good temperature uniformity and heat dissipation.