Abstract
This invention utilizes micro electro-mechanical manufacturing technique to provide a manufacturing method of glass micro fluid chip, which comprises using a photoresist as a glass etching mask to quickly define etching pattern by a standard lithographic process, providing a special baking process to reduce residual stress between the photoresist layer and the glass substrate, and finally using a hot melt bonding method to encapsulate the glass chip, which does not require complicated temperature ramping up and down process and can completely bond the glass chip with material of the same property. This invented process technique can be applied to manufacture various types of micro fluid chips using glass as the substrate.