Abstract
The invention provides an electronic component radiation heat dissipation device which comprises a heat dissipation substrate which comprises a heat dissipation substrate surface with a heat dissipation substrate surface heat emission rate; a heat emission rate modulation layer is formed on the surface of the heat dissipation substrate, the heat emission rate modulation layer comprises a heat emission rate modulation layer surface which has a heat emission rate modulation layer surface heat emission rate, and the heat emission rate modulation layer surface heat emission rate is larger than the heat emission rate of the surface of the heat dissipation substrate.