Abstract
This invention discloses heat dissipation devices for LED lamps with a plate-type heat spreader as the core unit. The plate-type heat spreader is either a flat-plate heat pipe or a metal plate embedded with heat pipes. The high-power LED lights are thermally connected to the bottom surface of the heat spreader so that the heat generated by the LED lights is absorbed by the evaporator region of the flat-plate heat pipe or the embedding heat pipes. The heat is spread by internal vapor motion toward different regions of the heat spreader. The top surface of the heat spreader is connected with a finned heat sink, where the heat is delivered to the ambient air. The hot air leaves by buoyancy through the openings on the lamp housing. Or the top surface of the heat spreader is connected with the inner surface of the lamp housing, with the heat dissipated out at the outer surface of the housing by natural convection.