Abstract
A polishing apparatus is disclosed, which comprises: a supporting plate having plural holes penetrating through the supporting plate; a rotating unit connecting with the supporting plate and enabling the supporting plate to rotate; a polishing pad locating on the supporting plate and is made of light transmissive material; a slurry supply unit for providing polishing slurry to a surface of the polishing pad; an ultraviolet (UV) light source locating below the supporting plate; and controlling unit connecting with the rotating unit and the UV light source, wherein the UV light source emits UV light, and the UV light passes through the holes of the supporting plate and illuminates the polishing slurry.