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積體電路元件檢測系統
Patent   Open access

積體電路元件檢測系統

國立清華大學, 黃稚存, 吳誠文 and 邢育肇
15/11/2006

Abstract

The present invention discloses a probing system for an integrated circuit device using wireless communication to transmit probing data between an automatic test equipment (ATE) and a device under test. The ATE comprises a first transceiving module, and the device under test comprises a core circuit, a built-in-self-test (BIST) circuit electrically connected to the core circuit, a controller for controlling the BIST circuit, and a second transceiving module for exchanging probing data with the first transceiving module. Preferably, the device under test further comprises a clock generator and a power regulator electrically connected to the second transceiving module, wherein the ATE emits a radio frequency signal through the first transceiving module, and the second transceiving module receives the radio frequency signal to drive the power regulator to generate power for the device under test to initiate the BIST circuit.
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