Abstract
A system in package method, the method includes: with physical property, chemistry nature deposit and selectivity etching mode on packaging body, spreads and plates individual layer, multiply conductive film as electric conductor. Because it is with the quality piece of homogenous material component, reaches many degrees of freedom of SOC inertia sensing subassembly of an efficiency nature adjusted, so can effectively promote the design elasticity of inertia sensing subassembly, reduce the manufacturing cost, the scope of application is wide, and the practicality is strong.