Abstract
The invention relates to an inertial sensor, and especially relates to a systematic packaging method. The systematic packaging method comprises providing a package, said package operable for packaging an object; and spreading and plating one or more conductive structures on said package; wherein said spreading and plating steps are performed by the methods selected from the group consisting of physically, chemistry deposit and selectively etching. The mass block is made of single material so as to form the system single chip multi-freedom inertial sensing module with adjustable functions, thereby effectively improving design elastic of the sensing module, and reducing making cost; the method is wide in suitable scope and strong in practicality.