Abstract
A new wafer level package is proposed in this invention. The present invention establishes a double pad interconnect structure to disperse the stress of the bump. The double pad structure includes bump pad, electrode pad and plural conductive columns of the package. The conductive columns are the interconnection between the electrode pad and the bump pad. Around the conductive columns is insulated material. Due to the buffer characteristic of the conductive columns and the insulated material, the stress of the bump can be dispersed and the reliability can be increased. Further, the double pad structure manufacturing are wafer-level processes and the manufacturing cost can be decreased.