Abstract
Disclosed is a thin film coating method, including disposing a substrate on a carrying surface of a heating board underneath a mobile scrapper such that a gap exists between the substrate and the mobile scrapper; heating the substrate by the heating board to reach a thermal balance temperature; filling an organic solution between the substrate and the mobile scraper by a multi-point unloading device for allowing the organic solution to be evenly distributed by a capillary attraction; and moving the mobile scrapper on the substrate in varied speeds to enable the organic solution to form an even thickness on the substrate, thereby achieving an even coating on the thin film.