Abstract
The present invention disclosed an electron beam apparatus of the patterned metal reduction, in which the metal lines or patterns can be directly produced on a substrate by the electron beam apparatus. The electron beam apparatus comprises, an electron beam system with functions of collimating, focusing and scanning the beam; a electron-transparent membrane with vacuum chamber for the electron beam to penetrate through, a stage placed in the direction of the electron beam window; a substrate disposed on the stage facing toward the direction of the electron beam; a thin liquid layer of a solution containing metal ions, disposed in the direction of the substrate surface facing the electron beam; an environment control device for controlling temperature, pressure, and atmosphere of the substrate.The present invention also relates to a method by using said electron beam apparatus of the patterned metal reduction, which the metal patterns can be directly formed on the substrate by using an electron beam, the electron beam is focused on the substrate, and the electron beam moving along the predesigned path of the patterns, reducing metal patterns on the substrate.