- Title
- 電子組件封裝結構及半成品組合體
- Creators - without role
- 曹哲之
- Identifiers
- 9957787778406774
- Academic Unit
- Department of Power Mechanical Engineering, College of Engineering, National Tsing Hua University
- Language
- Traditional Chinese
- Resource Type
- Patent
- Patent
- CN217214477U; CN217214477U
- Date application
- 08/02/2022
Patent
電子組件封裝結構及半成品組合體
16/08/2022
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