Abstract
The present invention relates to a method and an apparatus for bonding a patterned imprint to a substrate from a mold core by adhering means. The invented method for bonding a patterned imprint by transferring comprises: providing a top module having a mold core substrate, a mold core layer and a patterned anastatic layer, in which the surface of the patterned anastatic layer is coated with a release agent to form a release layer, and providing a base module having a substrate and being coated with a bonding layer thereon; filling a transfer layer material into the recess which is located between the patterned anastatic layer, and contacting and bonding the contact face on the top end of the transfer layer of the top module with the bonding layer of the base module, and applying a foreign force or an external action to form a strong adhesion between the transfer layer and the bonding layer; and removing the base module having a transfer layer after demolding, thereby completing the transfer printing of a patterned imprint.