Abstract
A 3D electronic packaging structure with enhanced grounding performance and an embedded antenna is provided to enable via-holes around an electronic element layer to enhance functions of a packaging unit by permitting electric signal connection between the upper and lower surfaces of the packaging structure. A 3D electronic packaging structure(300) comprises a substrate(318) for forming an electronic device, contact pads(306,309) disposed on the electronic devices, a buffer region distributed around the electronic devices, a grounding layer(311) formed on a second surface of the substrate, signal channels and the multiple signal contact(302,314,315). The buffer layer comprises a via-hole(308), and the signal connection between the upper surface of the buffer region and the grounding layer is constructed by filling a conductive material into the via-hole. The signal channels are formed at the one side of the electronic packaging structure. The signal contact is formed at an end portion of the signal channels, and distributed over at least one side of the electronic packaging structure.